China Suppliers Factory for Semiconductor Packaging Loading Plate & Continuous Coating Line for Passive Components
Machine Brief Description
It's a vertical or horizontal production line specifically engineered for the surface coating of chip resistors, various ceramic passive components, integrated circuit carrier boards, and printed circuit boards (PCBs). The machine features an automated sputtering coating system that utilizes a fully automated control mechanism, enabling high-precision sputtering operations and ensuring uniform coating thickness across all carrier plates and components. It is equipped with an advanced monitoring system that allows for real-time observation of production parameters. The machine's structural design is both rational and robust, facilitating stable operation and ease of maintenance. This design is conducive to long-term continuous production, thereby ensuring the stability of the production process and the quality of the final products.
Product Feature
1. High efficient, high volume, good stable and repeatable;
2. Adopting magnetron sputtering coating method, it can realise fully automatic continuous coating, single or double-sided coating;
3. Two kinds of structures: vertical or horizontal.
4. It is suitable for the coating treatment of various types of semiconductor packaging carrier boards and chip packaging carrier boards to improve their performance and reliability, and the surface coating of passive components, such as resistors, capacitors and other components to enhance their electrical performance and durability.
5. whether large-scale industrial production or small batch custom production, the equipment can provide efficient and stable coating solutions.
6. High level of automation, utilizing sophisticated automation control systems, minimizes manual intervention while enhancing the stability and consistency of production processes.
Technical Parameter
| Series | CJLX/CJLW Series |
| Technology | Microwave Sputtering |
| Chamber Size | Can be designed upon different request. |
| Substrate Material | Ceramic passive components such as resistors and capacitors; PCB circuit boards; IC Packaging Board (including hard board, ceramic board, glass board or flexible board); Ceramic Filter; |
| Coating Film | Metal Film (Ti, Cr, Ag, Al,) or Multiple Layers; |
| Vacuum System | Vacuum system select international famous brand or China famous brand molecular pumps (or diffusion pumps), polycold, mechanical pumps, etc. |
Frequently Asked Questions
What types of substrates can be processed with this sputtering system?
This production line is designed for various substrates, including ceramic passive components (such as chip resistors and capacitors), PCB circuit boards, ceramic filters, and IC packaging boards (including hard, ceramic, glass, or flexible boards).
What types of coating films can the machine deposit?
The machine is capable of depositing various metal films, such as Titanium (Ti), Chromium (Cr), Silver (Ag), Aluminum (Al), as well as complex multiple layers to enhance component electrical performance and durability.
Does the system support customized chamber sizes?
Yes, the chamber size is highly customizable. We can engineer and design the vacuum chamber configuration based on your specific substrate dimensions and production output requirements.
What structural configurations are available?
We offer two structural designs for this automated coating system: vertical or horizontal configurations, depending on your facility layout and workflow preferences.
How does the automation system ensure coating consistency?
The machine utilizes a fully automated control mechanism paired with an advanced real-time monitoring system. This ensures high-precision sputtering, uniform coating thickness across all carrier plates, and highly repeatable production runs.
What vacuum pump brands are integrated into the system?
The vacuum system utilizes high-quality molecular pumps (or diffusion pumps), polycolds, and mechanical pumps selected from internationally or domestically renowned brands to ensure stable, high-vacuum environments.
