China Suppliers Factory for Semiconductor Packaging Loading Plate & Coating Line for Passive Components
Machine Brief Description
Product Feature
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1. High efficient, high volume, good stable and repeatable;
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2. Adopting magnetron sputtering coating method, it can realise fully automatic continuous coating, single or double-sided coating;
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3. Two kinds of structures: vertical or horizontal.
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4. It is suitable for the coating treatment of various types of semiconductor packaging carrier boards and chip packaging carrier boards to improve their performance and reliability, and the surface coating of passive components, such as resistors, capacitors and other components to enhance their electrical performance and durability.
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5. whether large-scale industrial production or small batch custom production, the equipment can provide efficient and stable coating solutions.
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6. High level of automation, utilizing sophisticated automation control systems, minimizes manual intervention while enhancing the stability and consistency of production processes.
Technical Parameter
| Series | CJLX/CJLW Series |
| Technology | Microwave Sputtering |
| Chamber Size | Can be designed upon different request. |
| Substrate Material | Ceramic passive components such as resistors and capacitors; PCB circuit boards; IC Packaging Board (including hard board, ceramic board, glass board or flexible board); Ceramic Filter; |
| Coating Film | Metal Film (Ti, Cr, Ag, Al,) or Multiple Layers; |
| Vacuum System | Vacuum system select international famous brand or China famous brand molecular pumps (or diffusion pumps), polycold, mechanical pumps, etc. |
Frequently Asked Questions
What types of substrates can this sputtering coating machine process?
This equipment is highly versatile and suitable for ceramic passive components (such as resistors and capacitors), PCB circuit boards, ceramic filters, and various IC packaging boards (including hard, ceramic, glass, or flexible boards).
What is the difference between the vertical and horizontal structures?
The machine is available in both vertical and horizontal configurations to accommodate different production line layouts, factory space limitations, and specific material handling requirements.
What coating materials can be applied with this system?
It is designed to deposit metal films such as Titanium (Ti), Chromium (Cr), Silver (Ag), Aluminum (Al), or multiple layer configurations depending on your specific technological needs.
How does the system ensure coating uniformity and thickness control?
The machine utilizes a fully automated magnetron sputtering control system combined with real-time parameter monitoring. This ensures high-precision sputtering operations and consistent coating thickness across all carrier plates.
Can the vacuum system and chamber size be customized?
Yes, the chamber size can be customized according to your production requirements. Additionally, the vacuum system features high-quality international or Chinese brand molecular/diffusion pumps, mechanical pumps, and polycold systems tailored to your process.





