Hot Products
China Suppliers Factory for Semiconductor Packaging Loading Plate and Continuous Coating Line Machine for Passive Components
Machine Brief Description
It's a vertical or horizontal production line specifically engineered for the surface coating of chip resistors, various ceramic passive components, integrated circuit carrier boards, and printed circuit boards (PCBs). The machine features an automated sputtering coating system that utilizes a fully automated control mechanism, enabling high-precision sputtering operations and ensuring uniform coating thickness across all carrier plates and components. It is equipped with an advanced monitoring system that allows for real-time observation of production parameters. The machine's structural design is both rational and robust, facilitating stable operation and ease of maintenance. This design is conducive to long-term continuous production, thereby ensuring the stability of the production process and the quality of the final products.
Product Feature
- High efficient, high volume, good stable and repeatable;
- Adopting magnetron sputtering coating method, it can realise fully automatic continuous coating, single or double-sided coating;
- Two kinds of structures: vertical or horizontal.
- It is suitable for the coating treatment of various types of semiconductor packaging carrier boards and chip packaging carrier boards to improve their performance and reliability, and the surface coating of passive components, such as resistors, capacitors and other components to enhance their electrical performance and durability.
- Whether large-scale industrial production or small batch custom production, the equipment can provide efficient and stable coating solutions.
- High level of automation, utilizing sophisticated automation control systems, minimizes manual intervention while enhancing the stability and consistency of production processes.
Technical Parameter
| Series | CJLX/CJLW Series |
| Technology | Microwave Sputtering |
| Chamber Size | Can be designed upon different request. |
| Substrate Material | Ceramic passive components such as resistors and capacitors; PCB circuit boards; IC Packaging Board (including hard board, ceramic board, glass board or flexible board); Ceramic Filter; |
| Coating Film | Metal Film (Ti, Cr, Ag, Al,) or Multiple Layers; |
| Vacuum System | Vacuum system select international famous brand or China famous brand molecular pumps (or diffusion pumps), polycold, mechanical pumps, etc. |
Frequently Asked Questions
What types of components can this sputtering coating machine process?
This machine is specifically engineered for the surface coating of chip resistors, various ceramic passive components (such as capacitors), integrated circuit (IC) carrier boards, and printed circuit boards (PCBs).
What structural configurations are available for the production line?
The equipment is designed with flexibility in mind and is available in two structural configurations: vertical or horizontal, to fit different production line layouts and requirements.
What coating technology and thin films does the machine support?
The system utilizes advanced Microwave Sputtering technology. It is capable of depositing single or multiple layers of metal films, including Titanium (Ti), Chromium (Cr), Silver (Ag), and Aluminum (Al).
Which substrate materials are compatible with this coating system?
It supports a wide range of substrate materials, including ceramic passive components, PCB circuit boards, ceramic filters, and various IC packaging boards (such as hard boards, ceramic boards, glass boards, or flexible boards).
How does the machine ensure uniform coating thickness and stable operation?
The machine features an automated sputtering coating system with a fully automated control mechanism for high-precision operations. It also includes an advanced real-time monitoring system to track production parameters, ensuring uniform coating thickness and long-term production stability.
AF Movies
Camera Lens
Cell Phone Rear Cover
Optical Lens
01