E-Beam Evaporation
Electron beam evaporation is a type of physical vapor deposition. Unlike traditional evaporation methods, electron beam evaporation uses the coordination of electromagnetic fields to accurately achieve the use of high-energy electrons to bombard the target material in the crucible, melt it and then deposit it on the substrate. Electron beam evaporation can deposit high-purity and high-precision films.
Electron beam evaporation uses accelerated electrons to bombard the coating material. The kinetic energy of the electrons is converted into heat energy to heat and evaporate the coating material and form a film. Electron guns are divided into direct, ring and E types. The characteristics of electron beam heating evaporation are that it can obtain extremely high energy density, up to 109w/cm2, and the heating temperature can reach 3000-6000℃. It can evaporate refractory metals or compounds; the evaporated material is placed in a water-cooled crucible to avoid contamination of the crucible material. Electron beam evaporation deposition can prepare high-purity films. At the same time, multiple crucibles can be placed in the same evaporation deposition device to achieve simultaneous or separate evaporation and deposition of a variety of different substances. Most materials can be evaporated by electron beam evaporation.
Electron beam evaporation can evaporate high melting point materials. It has higher thermal efficiency, larger beam density, and faster evaporation speed than general resistance heating evaporation. The film produced has high purity and good quality. The thickness can be accurately controlled. It can be widely used to prepare various optical material films such as high-purity films and conductive glass.
Electron beam evaporation is often used to prepare alloy or oxide films of Al, CO, Ni, and Fe, SiO2, ZrO2 films, and corrosion-resistant and high-temperature resistant oxide films.
In terms of function, electron beam coating technology has the following characteristics:
I) High-precision coating: It can achieve precise control of film thickness and composition, thereby preparing films with specific properties.
2) Strong adjustability: The physical and chemical properties of the film can be easily adjusted to meet the needs of different applications.
3). High-quality film: The prepared film has good uniformity, density and stability.
4) Wide range of application: It is suitable for coating of a variety of materials, including metals, semiconductors, oxides, etc.
